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| ====General Procedure==== | | ====General Procedure==== |
| # Fixing/Replacing SMD Components | | # Fixing/Replacing SMD Components |
− | ## Before turning on the Air Bath, clamp the PCB on the black stand, preferably placing it so that the component you want to fix is directly above the air.. You should not be able to move the board once it is clamped. Keeping it sturdy helps from accidentally moving the PCB during the reworking process. | + | ## Before turning on the Air Bath, clamp the PCB on the black stand, preferably placing it so that the component you want to fix is directly above the air.. You should not be able to move the board once it is clamped. Keeping it sturdy helps from accidentally moving the PCB during the reworking process. |
| + | ## The Air Bath has a power switch on the left, three buttons on the right, and a screen on the right. The switch has 3 positions which allows you to choose Cool, Off, and Warm by pressing it in their respective directions. The button on the right allow you to adjust the temperature in a rather funny way. The middle button has a down arrow while the right button has an up arrow, indicating which button decreases/increases the temperature of the bath. However, you need to hold down the left button while doing so. For instance, to increase the temperature, you would hold the left and right buttons at the same time.[[File:AirBathBoi.jpg|none|thumb]] |
| ## Now you will heat up the Air Bath. Hit the Power switch on the front, and set the temperature about 20-30 °C below the solder's melting point. The melting point for your solder can be found using the table below. Voltera's Solder Paste (Orange) melts at lower temperatures than the Sn63Pb37 Solder Paste (Blue). If the Voltera Solder Paste says T4 at the top, heat the Air Bath to 180 °C. If the Voltera Solder Paste says T5 at the top, heat the Air Bath to 150 °C. If you are using the Sn63Pb37 Solder Paste, heat the Air Bath to 150 °C. [[File:...meltingPointTable.png|none|thumb]] | | ## Now you will heat up the Air Bath. Hit the Power switch on the front, and set the temperature about 20-30 °C below the solder's melting point. The melting point for your solder can be found using the table below. Voltera's Solder Paste (Orange) melts at lower temperatures than the Sn63Pb37 Solder Paste (Blue). If the Voltera Solder Paste says T4 at the top, heat the Air Bath to 180 °C. If the Voltera Solder Paste says T5 at the top, heat the Air Bath to 150 °C. If you are using the Sn63Pb37 Solder Paste, heat the Air Bath to 150 °C. [[File:...meltingPointTable.png|none|thumb]] |
− | ## Once the board is heated, you can use the Air Pencil to heat up a specific component. The pencil blows hot air out the end. When you turn it on, adjust the settings to be 3/4 of the heat capacity and about 1/3 of the air flow. We do this because when the air flow is maximized at full temperature, it does not get hot enough to melt the solder. | + | ## Once the board is heated, you can use the Air Pencil to heat up a specific component. The pencil blows hot air out the end. When you turn it on, adjust the settings to be 3/4 of the heat capacity and about 1/3 of the air flow. We do this because when the air flow is maximized at full temperature, it does not get hot enough to melt the solder. Too much air flow is bad. |
| ## Hold the tip of the pencil over the SMD you want to solder/desolder, and move it slightly around the leads to allow for more distribution of heat. If it is not heating it up, try turning the heat of the pencil higher. This should allow for your SMD components solder to melt, and you will be able to pick up the component up with a pair of static-safe tweezers or the Air Pick. If you are soldering a part on, make sure to generously apply flux to the pads, and make sure all the solder sticks to the pads after heating. | | ## Hold the tip of the pencil over the SMD you want to solder/desolder, and move it slightly around the leads to allow for more distribution of heat. If it is not heating it up, try turning the heat of the pencil higher. This should allow for your SMD components solder to melt, and you will be able to pick up the component up with a pair of static-safe tweezers or the Air Pick. If you are soldering a part on, make sure to generously apply flux to the pads, and make sure all the solder sticks to the pads after heating. |
− | ## If the pencil is not doing a good enough job to heat up the component, then you may graduate to using the bigger heat gun. The same theoretical concepts apply. | + | ## If the pencil is not doing a good enough job to heat up the component, then you may graduate to using the bigger heat gun, the Quick861DW. The same theoretical concepts apply. |
| ## The Air Pick uses a vacuum to pick up and place components. Typically you would use both hands for this; one hand heats up the component with the pencil and the other grabs the component with the pick. | | ## The Air Pick uses a vacuum to pick up and place components. Typically you would use both hands for this; one hand heats up the component with the pencil and the other grabs the component with the pick. |
| ## On the handle of the pick there is a divot that is connected to the vacuum. When you plug the divot with your finger, it will enable it to pick up a component. When you release your finger from the divot, it will let go of the component. There are different tips that you will place on the end of the tip based on the component you want to pick up, each having a different size for varying components. | | ## On the handle of the pick there is a divot that is connected to the vacuum. When you plug the divot with your finger, it will enable it to pick up a component. When you release your finger from the divot, it will let go of the component. There are different tips that you will place on the end of the tip based on the component you want to pick up, each having a different size for varying components. |
| # Desoldering Through Hole Components | | # Desoldering Through Hole Components |
− | ## | + | ## For desoldering through hole components, you will want to use the Desoldering Gun. It has a hot tip that can fit over a solder joint and utilizes a vacuum when the trigger is pulled. As a result, it melts the solder and sucks it into a cartridge, completely removing the joint. |
| + | ## Before using the Desoldering Gun, make sure you have the little metal stand for the gun to sit on for safety purposes. Have Solder ready nearby to tin the tip before use, and clean the tip after tinning using the wire mesh. |
| + | ## On the handle of the gun there is a temperature control wheel that ranges from 1-4 (coolest to hottest). Be sure to set it to the correct temperature using the graphic below. Typically, a through hole component would require you to set the scale to 2.[[File:...SolderingGun.png|none|thumb]] |
| + | ## To use the Desoldering Gun, briefly put the top over a solder joint (not completely on the PCB or you might damage it), press the trigger to enable the vacuum, and the solder should be sucked away! |
| + | ## Tin the tip before cooldown, and take note that the cooldown may take a bit of time. Don't burn yourself! |
| ==Safety== | | ==Safety== |
| Insert text | | Insert text |