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→General Procedure
====General Procedure====
====General Procedure====
# Fixing/Replacing Components
# Fixing/Replacing SMD Components
## Before turning on the Air Bath, clamp the PCB on the black stand, preferably placing it so that the component you want to fix is directly above the air.. You should not be able to move the board once it is clamped. Keeping it sturdy helps from accidentally moving the PCB during the reworking process.
## Before turning on the Air Bath, clamp the PCB on the black stand, preferably placing it so that the component you want to fix is directly above the air.. You should not be able to move the board once it is clamped. Keeping it sturdy helps from accidentally moving the PCB during the reworking process.
## Now you will heat up the Air Bath. Hit the Power switch on the front, and set the temperature about 20-30 °C below the solder's melting point. The melting point for your solder can be found using the table below. Voltera's Solder Paste (Orange) melts at lower temperatures than the Sn63Pb37 Solder Paste (Blue). If the Voltera Solder Paste says T4 at the top, heat the Air Bath to 180 °C. If the Voltera Solder Paste says T5 at the top, heat the Air Bath to 150 °C. If you are using the Sn63Pb37 Solder Paste, heat the Air Bath to 150 °C. [[File:...meltingPointTable.png|none|thumb]]
## Now you will heat up the Air Bath. Hit the Power switch on the front, and set the temperature about 20-30 °C below the solder's melting point. The melting point for your solder can be found using the table below. Voltera's Solder Paste (Orange) melts at lower temperatures than the Sn63Pb37 Solder Paste (Blue). If the Voltera Solder Paste says T4 at the top, heat the Air Bath to 180 °C. If the Voltera Solder Paste says T5 at the top, heat the Air Bath to 150 °C. If you are using the Sn63Pb37 Solder Paste, heat the Air Bath to 150 °C. [[File:...meltingPointTable.png|none|thumb]]
## Once the board is heated, you can use the Air Pencil to heat up a specific component. Direct the pencil onto
## Once the board is heated, you can use the Air Pencil to heat up a specific component. The pencil blows hot air out the end. When you turn it on, adjust the settings to be 3/4 of the heat capacity and about 1/3 of the air flow. We do this because when the air flow is maximized at full temperature, it does not get hot enough to melt the solder.
## Hold the tip of the pencil over the SMD you want to solder/desolder, and move it slightly around the leads to allow for more distribution of heat. If it is not heating it up, try turning the heat of the pencil higher. This should allow for your SMD components solder to melt, and you will be able to pick up the component up with a pair of static-safe tweezers or the Air Pick. If you are soldering a part on, make sure to generously apply flux to the pads, and make sure all the solder sticks to the pads after heating.
## If the pencil is not doing a good enough job to heat up the component, then you may graduate to using the bigger heat gun. The same theoretical concepts apply.
## The Air Pick uses a vacuum to pick up and place components. Typically you would use both hands for this; one hand heats up the component with the pencil and the other grabs the component with the pick.
## On the handle of the pick there is a divot that is connected to the vacuum. When you plug the divot with your finger, it will enable it to pick up a component. When you release your finger from the divot, it will let go of the component. There are different tips that you will place on the end of the tip based on the component you want to pick up, each having a different size for varying components.
# Desoldering Through Hole Components
# Desoldering Through Hole Components
##
==Safety==
==Safety==
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