Difference between revisions of "Reflow Oven"
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|Has model=ProtoFlow S N2 | |Has model=ProtoFlow S N2 | ||
|Has group=Circuit Board Design | |Has group=Circuit Board Design | ||
| − | |Has ace= | + | |Has ace=David Mishchenko;dmishchenko16@georgefox.edu |
}} | }} | ||
[[{{#show: {{FULLPAGENAME}}|?Has icon|link=none}}|100px|left|top|{{#show: {{FULLPAGENAME}}|?Has icondesc}}]] | [[{{#show: {{FULLPAGENAME}}|?Has icon|link=none}}|100px|left|top|{{#show: {{FULLPAGENAME}}|?Has icondesc}}]] | ||
Revision as of 11:00, 8 April 2019
The ProtoFlow S N2 is LPKF's premiere convection oven, ideal for lead-free reflow soldering, meeting the stringent demands of rapid PCB soldering applications. The ProtoFlow S N2 features even heat distribution, easy programming, and many pre-defined temperature profiles. The compact design and efficient power consumption make it one of the most useful components in any rapid PCB prototyping environment. [1]
The current Ace of the Reflow Oven is Isaac Beals (ibeals16@georgefox.edu).
Documentation
Training